羟磷灰石牙本质脱敏剂对温和型通用型粘接系统粘接性能研究

doi:10.7518/hxkq.2022.06.007

华西口腔医学杂志 ›› 2022, Vol. 40 ›› Issue (6): 668-675.doi: 10.7518/hxkq.2022.06.007

羟磷灰石牙本质脱敏剂对温和型通用型粘接系统粘接性能研究

孟雨晨¹(), 黄帆¹, 王思霖¹, 黄欣¹, 逯宜², 裴丹丹¹^,²()

^1.西安交通大学口腔医院陕西省颅颌面精准医学研究重点实验室，西安 710004
^2.西安交通大学口腔医院修复科，西安 710004

收稿日期:2022-05-16 修回日期:2022-09-10 出版日期:2022-12-01 发布日期:2022-11-23
通讯作者: 裴丹丹 E-mail:mengyuchen@stu.xjtu.edu.cn;peidandan1986@126.com
作者简介:孟雨晨，硕士，E-mail：mengyuchen@stu.xjtu.edu.cn
基金资助:
国家自然科学基金(81870798)

Bonding properties of mild universal adhesives to dentin pretreated with hydroxyapatite-based desensitizing agents

Meng Yuchen¹(), Huang Fan¹, Wang Silin¹, Huang Xin¹, Lu Yi², Pei Dandan¹^,²()

^1.Hospital of Stomatology, Xi’an Jiaotong University, Key Laboratory of Shaanxi Province for Craniofacial Precision Medicine Research, Xi’an 710004, China
^2.Dept. of Prosthodontics, Hospital of Stomatology, Xi’an Jiaotong University, Xi’an 710004, China

Received:2022-05-16 Revised:2022-09-10 Online:2022-12-01 Published:2022-11-23
Contact: Pei Dandan E-mail:mengyuchen@stu.xjtu.edu.cn;peidandan1986@126.com
Supported by:
The National Natural Science Foundation of China(81870798);Correspondence: Pei Dandan, E-mail: peidandan1986@126.com

摘要/Abstract

摘要：

目的本研究旨在评估含羟磷灰石（HA）脱敏剂封闭牙本质小管的效果及其对温和型通用型粘接剂粘接性能的影响。方法收集完整的第三磨牙，制备冠中部牙本质样本，建立牙本质敏感模型。根据不同的脱敏处理方式随机分为4组，分别进行下述处理：无脱敏处理（对照组）、Biorepair牙膏处理（含HA脱敏牙膏）、Dontodent牙膏处理（含HA脱敏牙膏）和HA糊剂处理。通过扫描电镜（SEM）观察牙本质小管封闭情况，并评估牙本质小管封闭率。分别使用All-Bond Universal、Single Bond Universal和Clearfil Universal Bond以自酸蚀模式应用于脱敏处理后的牙本质。通过接触角测量评估脱敏处理后牙本质表面的润湿性和表面能（SFE）。制备树脂-牙本质粘接试样，测试微拉伸粘接强度，分析脱敏处理方式对于3种通用型粘接剂的牙本质微拉伸粘接强度的影响。结果 SEM显示含HA脱敏牙膏和HA脱敏剂处理后牙本质小管均明显封闭，封闭率HA组>Biorepair组>Dontodent组（P<0.05）。接触角分析表明，含HA脱敏剂对通用型粘接剂的润湿性无显著影响（P>0.05），但脱敏处理后牙本质SFE显著增加（P<0.05）。微拉伸粘接强度测试表明，含HA脱敏牙膏会降低微拉伸粘接强度（P<0.05），而HA组与对照组的微拉伸粘接强度之间差异无统计学意义（P>0.05）。结论含HA脱敏牙膏能够形成牙本质小管封闭。在使用温和型通用型粘接剂进行后续树脂修复时，含HA脱敏牙膏降低牙本质粘接强度，而HA糊剂的脱敏处理未对粘接性能产生不利影响。

关键词: 牙本质敏感, 羟磷灰石, 通用型粘接剂, 微拉伸粘接强度, 自酸蚀模式

Abstract:

Objective The purpose of the study was to evaluate the effect of hydroxyapatite (HA)-based desensiti-zing agents and determine their influence on the bonding performance of mild universal adhesives. Methods Mid-coronal dentin samples were sectioned from human third molars and prepared for a dentin-sensitive model. According to desensitizing applications, they were randomly divided into four groups for the following treatments: no desensitizing treatment (control), Biorepair toothpaste (HA-based desensitizing toothpaste) treatment, Dontodent toothpaste (HA-based desensitizing toothpaste) treatment, and HA paste treatment. Dentin tubular occlusion and occluded area ratios were evaluated by scanning electron microscopy (SEM). Furthermore, All-Bond Universal, Single Bond Universal, and Clearfil Universal Bond were applied to the desensitized dentin in self-etch mode. The wettability and surface free energy (SFE) of desensitized dentin were evaluated by contact angle measurements. Bonded specimens were sectioned into beams and tested for micro-tensile bond strength to analyze the effect of desensitizing treatment on the bond strength to dentin of universal adhesives. Results SEM revealed that the dentin tubule was occluded by HA-based desensitizing agents, and the area ratios for the occluded dentin tubules were in the following order: HA group>Biorepair group>Dontodent group (P<0.05). Contact angle analysis demonstrated that HA-based desensitizing agents had no statistically significant influence on the wettability of the universal adhesives (P>0.05). The SFE of dentin significantly increased after treatment by HA-based desensitizing agents (P<0.05). The micro-tensile bond strength test showed that HA-based desensitizing toothpastes always decreased the μTBS values (P<0.05), whereas the HA paste group presented similar bond strength to the control group (P>0.05), irrespective of universal adhesive types. Conclusion HA-based desensitizing agents can occlude the exposed dentinal tubules on sensitive dentin. When mild and ultra-mild universal adhesives were used for subsequent resin restoration, the bond strength was reduced by HA-based desensitizing toothpastes, whereas the pure HA paste had no adverse effect on bond strength.

Key words: dentin hypersensitivity, hydroxyapatite, universal adhesive, micro-tensile bond strength, self-etch mode

中图分类号:

R 783.1

孟雨晨, 黄帆, 王思霖, 黄欣, 逯宜, 裴丹丹. 羟磷灰石牙本质脱敏剂对温和型通用型粘接系统粘接性能研究[J]. 华西口腔医学杂志, 2022, 40(6): 668-675.

Meng Yuchen, Huang Fan, Wang Silin, Huang Xin, Lu Yi, Pei Dandan. Bonding properties of mild universal adhesives to dentin pretreated with hydroxyapatite-based desensitizing agents[J]. West China Journal of Stomatology, 2022, 40(6): 668-675.

图/表 7

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试剂	主要成分	操作步骤
Biorepair脱敏牙膏	碳酸锌HA，水合二氧化硅，二氧化硅，碳酸氢钠，芳香剂	脱敏处理步骤：1）使用电动牙刷涂刷2 min；2）静置3 min；3.蒸馏水冲洗30 s。
Dontodent脱敏牙膏	HA，焦磷酸四钾，山梨醇，丙二醇，甘油，二氧化硅，芳香剂	同上
HA脱敏糊剂	纳米HA	同上
All-Bond Universal	10-MDP，HEMA，Bis-GMA，乙醇，水，光引发剂	粘接处理步骤：1）涂布两层粘接剂，涂擦10~15 s；2）气枪吹拂10 s；3）表面均匀光泽；否则额外涂布粘接剂，重复步骤2；4）光固化10 s。
Single Bond Universal	10-MDP、HEMA、Bis-GMA、DCDMA、MPTMS、Vitrebond^TM共聚物、硅烷、乙醇、水、光引发剂	粘接处理步骤：1）涂布粘接剂20 s；2）气枪轻吹5 s；3）光固化10 s。
Clearfil Universal Bond Quick	10-MDP，2-HEMA，Bis-GMA，亲水性甲基丙烯酸酰胺，MPTMS，NaF，胶体二氧化硅，硅烷偶联剂，光引发剂	粘接处理步骤：1）涂布粘接剂；2）气枪轻吹5 s以上；3）光固化10 s。

组别	牙本质小管暴露面积/μm²	封闭率/%
对照组	1 246.05±214.58^A	-
Biorepair组	550.54±55.24^B	55.82±4.43^b
Dontodent组	670.38±67.01^B	46.20±5.38^c
HA组	210.13±55.49^C	83.14±4.45^a

组别	接触角			SFE
组别	ABU组	SBU组	CUB组	SFE
对照组	41.10±4.56^Ab	70.89±5.96^Aa	71.77±2.85^Aa	48.67±2.33
Biorepair组	42.89±7.23^Ab	66.07±5.91^Aa	75.82±3.12^Aa	63.24±3.55^*
Dontodent组	36.24±2.40^Ab	70.48±7.60^Aa	77.64±7.16^Aa	71.41±5.28^*
HA组	42.08±5.12^Ab	70.84±5.97^Aa	78.73±3.98^Aa	56.95±6.07

组别	ABU组		SBU组		CUB组
组别	粘接强度	断裂模式（A/M/CD/CC）	粘接强度	断裂模式（A/M/CD/CC）	粘接强度	断裂模式（A/M/CD/CC）
对照组	51.55±4.79^aB	28/7/0/5	56.30±5.21^aA	15/10/3/12	56.80±5.00^aA	27/9/1/3
Biorepair组	47.62±6.68^bB	12/16/0/12	51.62±5.56^bA	20/10/4/6	50.77±5.54^bAB	24/16/0/0
Dontodent组	51.89±4.75^aB	15/9/5/11	57.47±5.93^aA	16/10/2/12	50.80±5.59^bB	20/15/2/3
HA组	51.89±5.47^aB	27/3/1/9	58.39±5.11^aA	20/10/0/10	56.10±5.36^aA	14/10/8/8

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羟磷灰石牙本质脱敏剂对温和型通用型粘接系统粘接性能研究

Bonding properties of mild universal adhesives to dentin pretreated with hydroxyapatite-based desensitizing agents

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